CC Texas Instruments RF Transceiver datasheet, inventory, & pricing. CC The CC is a low cost true single chip UHF transceiver designed for very low power wireless applications. The circuit is mainly intended for the ISM. Highly Integrated MultiCh RF Transceiver Designed for Low-Power Wireless Apps. Datasheet Texas Instruments CC
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At the present time Datadheetthree designs have been published for the CC chip, but the first two are no longer recommended. The layer directly below the components should be a solid ground. By using a single trace the pins are no longer isolated from each other.
This provides us with the ability to offer several options to our clients while using a consistent and proven transceiver architecture.
Layout Resources from Pegasus Technologies. The whole memory can be erased using the Bulk Erase instruction, or a sector at a time, using the Sector Erase instruction.
The versatility of this chip is enhanced by its integrated and highly configurable baseband modem, which supports a number of different modulation formats and data rates.
The RF transceiver is integrated with a configurable baseband modem. Thus, the whole memory can be viewed as consisting of pages, or 1, bytes. In designing circuits using their components, Texas Instruments’ website provides very helpful documentation and design examples. The complete file can be obtained from the Worldsens web site.
CC Datasheet(PDF) – List of Unclassifed Manufacturers
The correct procedure is to route an individual trace from each pin to its associated capacitor. In this case, if the width is wider than the component pads, the trace will have to be reduced just before entering the pad. When pins are located next to each other and have a capacitor associated with each one, these components must be connected individually.
The current design has improvements to eliminate harmonic emission as well as variations based dztasheet power settings. TI also continuously works to improve their reference designs. Conclusion This article, if read in conjunction with the excellent TI application notes for this chip, will make it easier to incorporate the CC into your design.
The current version at the time this article was written is Rev D, dated May 29, For more information on the M25P80 flash memory, the datasheet can be found at ST. The memory can be programmed 1 to bytes at a time, using the Page Program instruction. The architecture, combined with five low power modes is optimized to achieve extended battery life.
Schematic of the WSN board Don’t let that stop you, there are still some good articles here! Paperback – pages, 2nd edition November 2, As with the filter balun section, the ground plane below the trace must be solid up to the antenna. Hardcover – pages July If one inductor is placed so that it has a very short straight trace, the other inductor will not fit in front of its datasheet pin.
Originally developed by ChipCon, this chip has continued as an active TI product following their acquisition of ChipCon in early Note that the humidity sensor is optional and by default it is not build on the WSN node. Each page is bytes wide. The MCP combines constant voltage, constant current regulation, cell preconditioning, cell temperature monitoring, advanced dataasheet timers, automatic charge termination, and charge status and fault indication.
Some of the older data sheets still show the older designs, however, so RF engineers using this chip should be sure to download the most recent version from the TI website when beginning a new design.
For this reason, it is very important to keep the component spacing and traces as equal as possible.
Filter Topology One of the key pieces of a design using the CC is the filter balun. With a multi-layer board, the first inner layer dwtasheet be a solid plane, which will accomplish this requirement rather easily. This microcontroller, an ultra-low-power bit RISC mixed-signal processor, is ideal for low power and portable applications.
Because of the importance and multi-tasking required by this portion of the design, there are some important considerations in layout that need to be taken into account. The following sections will provide descriptions of the more important sections along with pictures showing the recommended and not recommended ways of configuring them.
This will cause the trace for the second inductor to be longer with more bending. Data is transferred serially through the 1-Wire protocol.
However since that is not possible, the next best approach is to minimize the amount of inductance within the trace by making it as wide as possible based on the size of the component pads. While the advice presented here may seem simple, failure to apply these techniques may result in a circuit that does not perform as desired.